| 摘要 |
PURPOSE:To improve the peeling strength of a solder, by providing at least one projection having a height of 0.l-0.5 mm on the soldered surface of a lead frame for connecting a thick film printed substrate of a hybrid IC to an external terminal of a molded case. CONSTITUTION:A lead frame 4 connected to an internal terminal 1 of a molded case 2 is soldered to a hybrid IC substrate 3 with a solder 5. A projection 4a is provided on the soldered face of the lead frame 4 so as to ensure the solder layer H uniformly. In this manner, the peeling strength of the solder 5 can be improved. |
