| 摘要 |
PURPOSE:To decrease the area occupied by a tape carrier, by providing conductor patterns on both top and rear faces of an insulation film and connecting them through through holes. CONSTITUTION:On the top face of an insulation film 1, a part of conductor patterns l0 are formed for providing wirings 2 and testing electrodes 3. The other conductor patterns are provided on the rear face of the film 1. The conductor patterns on the top and rear faces are connected to each other through through holes 4. Such construction decreases the area occupied by a tape carrier for semiconductor devices.
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