| 摘要 |
PURPOSE:To prevent an adverse effect on a circuit substrate by heat generation by interposing an electronic cooling element between a semiconductor chip and the substrate and integrally bonding the semiconductor chip, the substrate and the electronic cooling element. CONSTITUTION:With a power transistor, a semiconductor chip 1 is mounted a central substrate 3, holding an electronic cooling element 2, and each electrode of a base and an emitter for the silicon transistor chip 1 is wire-bonded with lead terminals, a base terminal 31 and an emitter terminal 32, by gold wires 14. Central substrate 3 itself is set so as to function as a collector terminal 33. These silicon transistor chip 1, electronic cooling element 2 and central substrate 3 are packaged by a resin mold 5. |
