| 摘要 |
PURPOSE:To easily perform a clean and complete drying work on semiconductor wafers and to improve the quality of the semiconductor wafers by a method wherein wafers are conveyed from one side to the other side of the first and the second revolving bodies, a rotational speed thereof is given by a driving device to the first and the second revolving bodies, and the moisture on the surface of the semiconductor wafers are removed by scattering using centrifugal force. CONSTITUTION:The revolution of a motor 700 is transferred to the rotating shaft 220 of the center chuck 200 which is coupled by a coupling device 710, it is then transferred to the rotating shaft 130 of the outer circumference chuck 100 by a pin 500, and the semiconductor wafer 800 held by absorption by the first vacuum system 110 starts rotation. The rotation of the semiconductor wafer 800 is started, and when said rotation reaches the prescribed speed of rotation, the waterdrops on the surface of the wafer 800 are scattered to outside the semiconductor wafer 800 by the rotational centrifugal force. When the rotation of the prescribed period is finished, the driving system of the motor 700 is turned OFF, the arm 410 of an air cylinder 400 is extended, the rotating shaft 130 of an outer circumferential chuck 100 is lowered, and the semiconductor wafer 800 is transferred for mounting from the outer circumferential chuck 100 to the center chuck 200. |
