| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multiple patterning ceramic substrate to be a small-size electronic component storing package, which is easily divided along dividing lines and provided with a metallize layer capable of rigidly connecting and fixing an external electric circuit substrate, a lid body or the like, and to provide the manufacturing method therefor as well as a multiple patterning electronic component storing package and an electronic device. <P>SOLUTION: The multiple patterning ceramic substrate is provided on the main surface of a ceramic matrix substrate 1 with partitioning grooves 3 for dividing the substrate 1 into a plurality of divisions, while a ceramic layer 6 made of a material same as that of a ceramic matrix substrate 1 is formed from the inner surface of the partitioning grooves 3 to the periphery of the partitioning grooves 3 on the main surface. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
