MANUFACTURE OF PACKAGE FOR SEMICONDUCTOR

摘要

PURPOSE:To facilitate manufacture of a substrate and manufacture of circuit patterns by a method wherein resin is injected into a die to mold the substrate solidly and then the substrate is released from the molding die so as to transcript the circuit patterns from a circuit pattern forming unit onto the substrate. CONSTITUTION:External continuity pins 7 which connect circuit patterns 1 to conducting parts outside a package and a heat sink 8 which discharges heat are provided at predetermined positions in a cavity 6 to be solidly molded in a substrate 3. Then resin is injected from a gate 9. If resin to which plating can be applied is used to form the circuit patterns 1, the resin to which plating metal does not adhere when the circuit patterns 1 are plated is employed as the cast resin 10. After the cast resin 10 is cured, the substrate 3 is released from a molding die 5. As the circuit patterns 1 are firmly unified with the resin 10 forming the substrate 3, the circuit patterns 1 can be released easily from a circuit forming unit 2 which is made to adhere lightly to the circuit patterns 1.