| 摘要 |
PURPOSE:To form an automatic inspection apparatus for IC lead frame which efficiently and automatically realizes the inspection of IC lead frame by providing a loading device, an inspection device, a fault takeout device and an unloading device to the transfer line. CONSTITUTION:An IC lead frame 1 is first supplied and set to the starting part of transfer line 3 by a loading device 2. Next, it is then sent to an appearance inspection device 4 which is one of the inspection devices 45 for the appearing inspection. The appearance fault 46 is taken out from the transfer line 3 by the appearance fault takeout device 5 which is one of the fault takeout devices 47. Meanwhile, the good products is sent to a plating thickness inspection device 48 for the planting thickness inspection by sampling the IC lead frames 1 from the transfer line 3. Upon completion of plating thickness inspection, the IC lead frame 1 is once returned to the transfer line 3 even if it is good 49 or fault 50. Next, only the good products 49 are taken out from the transfer line 3 by the good product takeout device 51 of the unloading device 6 and these are stacked for each lot.
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