发明名称 PACKAGE FOR CONTAINING HYBRID INTEGRATED CIRCUIT ELEMENT
摘要 PURPOSE:To prevent the generation of cracks and fractures in a tubular ceramic body completely, by soldering outer lead terminals to the inside of through holes of the tubular ceramic body through silver soldering material. CONSTITUTION:A package comprises a metal base body 1, outer lead terminals 4 and a metal cap 2. At this time, each terminal 4 is soldered to the inner wall of a through hole 5a of a ceramic body 5 through silver soldering materials 6 and 7. Even if contracting force due to the solidification of the soldering materials 6 and 7 acts on the inner wall of the through hole 5a of the ceramic body 5 and tensile stress is applied, said tensile stress is absorbed by deforming the soldering materials 6 and 7 themselves. Thus the generation of cracks and fractures in the ceramic body 5 can be completely prevented.
申请公布号 JPS62217641(A) 申请公布日期 1987.09.25
申请号 JP19860061631 申请日期 1986.03.18
申请人 KYOCERA CORP 发明人 UEDA YOSHIAKI
分类号 H01L23/02;H01L23/04;H01L23/10;H01L23/48;H01L23/50 主分类号 H01L23/02
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