| 摘要 |
PURPOSE:To prevent the adhesion of foreign substances on wafers while a photoresist process is being performed by a method wherein the foreign substances are discharged from a local exhaust hole provided at the part where foreign substances are easily generated on an aligner. CONSTITUTION:The chipped pieces of a wafer 9 and the other foreign substances, generated by the collision between the wafer 9 and the metal idler 13 constituting an orientation flat detecting structure, are passed through a local exhaust duct 23 and the foreign substances generated by the collision between the spring to be used for inclination of position, a lifting-up stick 12, a prealignment station 10 and the like are forcedly discharged by a forced exhaust source 25 through a local exhaust duct 24. As a result, the foreign substance generated at the positioning part 6 of the aliner is forcedly exhausted passing through local exhaust ducts 23 and 24, and the adhesion of the foreign substance to the surface of the wafer 9 located on the prealignment station 10 can be prevented. |
