发明名称 MANUFACTURE OF LAMINATED PLATE
摘要 <p>PURPOSE:To provide a manufacturing method of laminated plate in which a releasing film is not transferred to contaminate by piling two laminated plate materials, with the resin impregnated base side inside and with a releasing film interposed for laminate molding. CONSTITUTION:An epoxy composite copper-clad laminated plate 1 consists of a paper base 2 impregnated with epoxy resin placed in the central part and used as a resin impregnated base, glass bases 3a and 3b impregnated with epoxy resin placed on both sides of the paper base, and a copper foil 4 as a metal foil at the extreme outer side. Said two units of laminated materials are placed with their epoxy resin impregnated glass bases 3b facing each other, and with a releasing film 5 inserted between them, the whole of two units are inserted between two plates 6 of laminate molding machine. By said laminate molding, two of epoxy resin composite copper-clad laminated plates with ones side copper foil-clad are prepared. By said constitution, the releasing film is not transferred to the plates of laminate molding machine to contaminate the film, and the plates can be used continuously by preparing two units of laminated plates by one laminate molding treatment and one releasing film to enhance productivity.</p>
申请公布号 JPS62214939(A) 申请公布日期 1987.09.21
申请号 JP19860057345 申请日期 1986.03.15
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SUZUKI SHIGEO;ONARI SEIJI
分类号 B32B37/10;B32B15/08;B32B37/00;H05K1/03 主分类号 B32B37/10
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