发明名称 METHOD FOR REGENERATING CHEMICAL COPPER PLATING SOLUTION
摘要 PURPOSE:To efficiently remove ions accumulated in a chemical copper plating soln. by adding an anionic chelating agent forming a chelate compound with a cuprous ion to a soln. in a cathode chamber when impurities are removed from the plating soln. by electrodialysis. CONSTITUTION:An electrodialytic cell is divided into a chamber for regenerating a plating soln., anode and cathode chambers with two anion exchange resin membranes. An anionic chelating agent forming a chelate compound with a cuprous ion is added to a soln. in the cathode chamber. The regenerating is filled with a chemical copper plating soln. contg. copper ions, a copper ion chelating agent, a copper ion reducing agent, and a pH adjusting agent as essential components. DC voltage is then applied between the cathode and anode placed in the cathode and anode chambers, respectively. Counter anions to copper ions and ions of an oxidation reaction product of the reducing agent are selectively removed from the plating soln. by electrodialysis.
申请公布号 JPS62207879(A) 申请公布日期 1987.09.12
申请号 JP19860052006 申请日期 1986.03.10
申请人 NEC CORP 发明人 OTA HIROTOKU
分类号 B01D61/44;C23C18/16;C23C18/40 主分类号 B01D61/44
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