| 发明名称 |
CONDUCTIVE COMPOSITION |
| 摘要 |
<p>An electrically conductive composition containing a photosensitive epoxy polymer, a reactive plasticizer, and electrically conductive spherical particles wherein the outer surfaces are of a material selected from the group of platinum, palladium and gold. The compositions are used to provide a flexible electically conductive bond between a supporting substrate and a semiconductor.</p> |
| 申请公布号 |
JPS62199611(A) |
申请公布日期 |
1987.09.03 |
| 申请号 |
JP19870002008 |
申请日期 |
1987.01.09 |
| 申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
CHIYAARUZU AANORUDO JIYOSEFU;JIEEMUZU RARUFU PETOROZERO |
| 分类号 |
C04B26/14;C08G59/00;C08G59/18;C08G59/20;C08G59/32;C08G59/40;C08G59/62;C08G59/68;C08K3/08;C08L63/00;G03C1/00;G03F7/004;H01B1/22;H05K3/32 |
主分类号 |
C04B26/14 |
| 代理机构 |
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代理人 |
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| 地址 |
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