| 摘要 |
PURPOSE:To manufacture a plastic card embedded with a foreign substance or an integrated circuit device, for example, by a method wherein a form having the same configuration and the same size as an objective foreign is embedded in one surface of the plastic card so as to be exposed when a plurality of plastic sheets are laminated by molding while the objective foreign substance is fitted to and embedded into a hole made by the form after the lamination molding of the card is finished. CONSTITUTION:A hole 1c having the same configuration and the same size as an objective foreign substance to be embedded is bored in one sheet 1a of hard vinyl chloride sheets 1a, 1b, while a form 2a is inserted into the hole 1c. The thickness of the form 2a is made equal to or thicker than the thickness of the sheet 1a. The sheet 1a, fitted with the form 2a, is piled on the other sheet 1b and both of them are laminated and molded by thermal bonding effected between mirror plates 3a, 3b. In this case, the form 2a is flushed with the surface of the sheets 1a, therefore, the form comes intimated with a plastic card 4 sufficiently and is embedded perfectly without remaining any clearance. The form 2a is improved and the objective foreign substance 2 is fitted into the hole formed by the form 2a, whereby the plastic card embedded with the foreign substance can be obtained.
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