| 发明名称 |
Use of a soft solder alloy for bonding (connecting) ceramic parts |
| 摘要 |
The use of a soft solder alloys for bonding ceramic parts without premetallisation is described. They comprise from 86 to 99% of lead or tin, from 0 to 13% of silver and/or copper, from 0 to 10% of indium and from 1 to 10% of titanium and/or zirconium and/or hafnium.
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| 申请公布号 |
DE3641679(A1) |
申请公布日期 |
1987.08.20 |
| 申请号 |
DE19863641679 |
申请日期 |
1986.12.05 |
| 申请人 |
DEGUSSA AG |
发明人 |
BOEHM,WOLFGANG,DR.-ING.;HAUSSELT,JUERGEN,DR.-ING.;WEISE,WOLFGANG,DIPL.-ING.DR.;MALIKOWSKI,WILLI |
| 分类号 |
B23K35/26;C04B37/00;C04B37/02;(IPC1-7):B23K35/26;C22C11/00;C22C11/10 |
主分类号 |
B23K35/26 |
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