| 摘要 |
PURPOSE:To make it possible to mount an integrated circuit of multiple pins and high power by a facile manufacturing step to form a structure of high heat dissipation effect by composing a mounting structure in which a lead frame of the integrated circuit can be used as a terminal for external connection. CONSTITUTION:An integrated circuit 3 of tape carrier system provided with a lead frame 2 formed by cutting in advance is fixed to a ceramic package 1 by a good heat conductivity material such as a solder. Furthermore, a ceramic plate 4 is attached to the package by a glass sealing material 5 and it is sealed hermetically. The lead frame 2 is led out to the outside through a sealing part and it forms a terminal for external connection as it is. Thus, in this constitution, the integrated circuit 3 is fixed to the ceramic package 1 in a manner the lead frame 2 is available as an external connection terminal and it is hermetically sealed by a ceramic plate 7. |
