| 摘要 |
PURPOSE:To prevent the contacts of adjacent bonding wires by bending each of internal leads to the central side of a package on its midway extending toward the inside and lengthening respective internal lead toward the ends of the package. CONSTITUTION:Internal leads 2 are formed along each side on the rectangular peripheral section 1B of a package 1 for a semiconductor device surrounding a semiconductor chip 3. External ends crossing with the periphery of the package 1 of respective lead 2 are positioned at regular intervals along the periphery of the package 1, and the leads 2 are extended toward the inside at approximately straight angles to each side of the package 1 from the external ends. Sides directed toward the chip 3 of respective lead 2 are each bent from approximately intermediate sections, and directed toward the center of the chip 3. The length of the leads 2 is lengthened toward the end sections of the sides of the package at the same time, and the differences of distances among the internal ends of the leads 2 and bonding pads 4 corresponding to the leads 2 are reduced at the centers and ends of each side of the package 1. Accordingly, adjacent bonding pads are difficult to be brought into contact. |
