| 摘要 |
PURPOSE:To prevent packing variation of welding glass for bonding by forming a thin film coil to one back part at least of one core half and forming a magnetic path passing through the center of the coil by a couple of core halves. CONSTITUTION:Plural thin film coils are laminated to a butt face of a core half, an SiO2 film 4 is formed to a ferrite wafer 3, the 1st conductor layer 5 is provided by vapor deposition and a pattern of a regist is applied onto the 1st conductor layer. Then the conductor layer 5 except the part subjected to resist is removed succeedingly and the resist 6 is removed. Then the 1st insulation layer 7 and the 2nd conductor layer 8 are applied to bond the conductor 5a to a part 8a of the 2nd conductor layer to coat the 2nd insulation layer 9. Thus, the lst ferrite wafer 3 forming the coil 10 is stuck to a tilt part 12 of a tool base 11, the projection 18 of front side of the 2nd ferrite wafer 13 is pressed into contact with the rest 17, a rear side projection 19 is inserted into a center hole 20 of the coil 10 to form the magnetic path passing through the center of the coil. Thus, the variation of packing of the weld glass for bonding is avoided.
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