| 摘要 |
Microplastic structures, thermally stable up to at least 200 deg.C are produced by (a) coating a substrate with a photosensitive compsn. contg. 40-99.9 wt.% crosslinkable polymer and 0.1-60 wt.% photoacid generator, (b) exposing the coating through one or more photomasks to light, (c) heating to 70-120 deg.C to crosslink the exposed coating(s), and (d) removing portions of the coating with an aq. base soln. Pref. the microplastic structure is in the positive or negative mode and the coating is exposed to a near UV light source. The compsn. pref. contains (i) 3-50 wt.% aminoplast, 90-40 wt.% of reactive H-contg. cpd. and 2-30 wt.% photoacid generator sensitive to near UV light or (ii) 50-95 wt.% phenoplast, 40-3 wt.% HCHO generating cpd. and 2-30 wt.% photoacid generator sensitive to near UV light, (iii) 95.99.9 wt.% acid-hardening resin, 0.1-5 wt.% photoacid generator sensitive to deep UV light at an exposure dosage of 10Mj/sq.cm. |
