| 摘要 |
PURPOSE:To improve the reliability of an IC package by burying a crack development preventing material in a molding resin to prevent the crack generated from the interior of the resin and particularly from a many cracking portion from developing. CONSTITUTION:Since cracks 8 tends to occur from corners of the end of a placing base 3, the end of an IC element 5 or the end of a lead pin 4 in a resin 7, a crack development preventing material 10 is so buried to cover this portion, i.e., a many cracking portion 9. The crack development preventing material is preferably fiber or woven fabric of the fiber. Since the material 10 is buried only in the vicinity of the cracking portion 9, the development of the generated cracks 8 can be almost prevented. When the material 10 is buried entirely in the resin 7 and the density is so decided that the portion near a lead frame 2, i.e., the deep portion in the resin is dense and the vicinity of the outer surface of the resin 7 is rough, the development of the crack can be completely prevented. |
