| 摘要 |
PURPOSE:To automatically select nondefective or defective chips by simple processes and to send them to the following process by a method wherein chips are tested by a tester to discriminate whether they are good or bad, the test result is recorded in the memory as map data, the wafer is cut chip by chip after the test and the nondefective chips are selected corresponding to the map data. CONSTITUTION:An address to correspond to the prescribed X-Y coordinates is given to each chip 7 arranged on a wafer 3 and information on nondefective chips 8 and defectives 9 is recorded in a memory (d) as map data on the basis of the test result to be performed by a tester (c). The test ended wafer 3 is cut by a cutting unit in every chip 7. The nondefective chips 8 alone are selected by a pickup mechanism (f) for chip and are installed on a die-bonding substrate 11. The test result is sent from a wafer prober (b) through a communication circuit 10 as map data according to requested data from a die-bonding unit (die-bonder) 5. The selection of the nondefectives is performed using the test data.
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