| 摘要 |
PURPOSE:To avert the stress concn. to a silicon pedestal and to prevent the cracking or breakdown of the silicon pedestal by connecting a metallic stem and can be using a solder brazing filler metal. CONSTITUTION:Lead tin solder 21 is used as the brazing filler metal and the metallic stem 3 is connected to a windowed cap 7 by said solder. More specifically, the lead tin solder is molded to an annular shape and the molded solder is placed on a collar part 3a of the metallic stem 23; further the windowed cap 7 is put thereon. The solder is then melted in a vacuum by using IR rays or is heated to melt in hydrogen or hydrogen forming gas or if a flux is incorporated into the solder, the solder is heated to melt in air or nitrogen, by which the metallic stem 3 and the windowed cap 7 are adhered. The subsequent stages for assembling the sensor after the end of the adhesion are exactly the same as the conventional stages for assembling the sensor.
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