发明名称 PROCEDIMIENTO PARA LA FABRICACION DE PLACAS DE CIRCUITO IMPRESO
摘要 <p>Labile electrostatic images corresponding to the required conductive patterns on each side of a required printed circuit board, having components on one side and a wiring pattern on the other side, are formed, electrically conductive powder (27) is applied to the images and the resulting powder pattern is transferred by printing onto an insulating sheet (FSI-FS2). The resulting sheets are applied onto each face of a rigid support and the sheets carried by the support (SR) are treated to enlarge the tracks of conductive material and the support is mechanically worked in the conventional manner to give the board its final shape.</p>
申请公布号 ES552730(D0) 申请公布日期 1987.07.01
申请号 ES19300005527 申请日期 1986.03.06
申请人 TELETTRA LAB TELEFON 发明人
分类号 H05K1/02;H05K3/10;H05K3/12;H05K3/18;H05K3/20;H05K3/24;(IPC1-7):H05K3/12 主分类号 H05K1/02
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