A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.
申请公布号
EP0179801(A4)
申请公布日期
1987.06.30
申请号
EP19850901779
申请日期
1985.03.19
申请人
MOSTEK CORPORATION
发明人
MULHOLLAND, WAYNE, A.;QUINN, DANIEL, J.;BOND, ROBERT, H.;OLLA, MICHAEL, A.
