发明名称 PICK-UP METHOD FOR SEMICONDUCTOR PELLET
摘要 <p>PURPOSE:To facilitate the pick-up of a semiconductor pellet by means of a vacuum collet and thereby the ensure a pick-up operation even with respect to a dicing tape having strong adhesion by a method wherein said semiconductor pellet to be picked up by the vacuum collet is thrusted up in a plurality of times by a thrust needle. CONSTITUTION:One semiconductor pellet 12 on a dicing tape 13 is positioned just above a thrust needle 14 with the movement of an XY table to which a frame body 11 is fixed. Then, a cam 17 is driven to rotate, a first projection 17a of the cam 17 comes in contact with a cam follower 18, a shaking arm 21 is once shaken thereby in the direction A indicated by an arrow, and the thrust needle 14 thrusts up once the semiconductor pellet 12 on the dicing tape 13. With further rotation of the cam 17, a second projection 17b comes in contact with the cam follower 18, and thereby a second thrusting operation is conducted. At a time point at which a vacuum collet 16 starts to rise, on the other hand, the semiconductor pellet 12 is put in a state wherein it is held between the thrust needle 14 and the vacuum collet 16, and thus it is exfoliated from the dicing tape 13.</p>
申请公布号 JPS62141733(A) 申请公布日期 1987.06.25
申请号 JP19850282611 申请日期 1985.12.16
申请人 TOSHIBA SEIKI KK 发明人 IWAKI YASUO
分类号 H01L21/67;H01L21/301;H01L21/68;H01L21/78 主分类号 H01L21/67
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