发明名称 WAFER TRANSFER APPARATUS
摘要 PURPOSE:To prevent direct contact between up-and-down moving beams and heat treating plates and to prevent yield of dust, by attaching up-and-down moving beam guide members, which hold the up-and-down moving beam from both sides with a specified gap being provided, and setting the width of the gap so that it is smaller than the groove in each heat treating plate. CONSTITUTION:Members 20 are attached to two places with respect to one up-and-down moving beam 5, i.e., to the side surface of a heat treating plate 1 on the side of a transfer belt 5 and to the side surface of a heat treating plate 2 in the direction of an outgoing belt 4 so that the members can be attached and removed. The members are provided at four places with respect to the two up-and-down moving beams 5 and 5. The width B of the gap in a groove 20a of each up-and-down moving beam guide member 20 is set so that it is smaller than the width A of grooves 1a and 2a of the heat treating plates 1 and 2. The material of the up-and-down moving beam guide members 20 is a low friction material, e.g., Teflon and the like. The material can resist the high temperature of the heat treating plates.
申请公布号 JPS62137838(A) 申请公布日期 1987.06.20
申请号 JP19850279810 申请日期 1985.12.12
申请人 MITSUBISHI ELECTRIC CORP 发明人 TOMIDOKORO MAKOTO
分类号 H01L21/324;H01L21/67;H01L21/677;H01L21/68 主分类号 H01L21/324
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