发明名称 SPUTTERING TARGET
摘要 PURPOSE:To prevent solder for adhesion from being sucked up between divided target pieces and to improve the cooling efficiency for a target body by chambering the end faces of said pieces intersecting with the adhesive surfaces to a cathode electrode. CONSTITUTION:The target pieces 14 which are divided to plural pieces are arrayed on the cathode electrode 11 in such a manner that the side faces thereof contact each other. The end faces of the pieces 14 where the adhesive surfaces to the electrode 11 and side faces intersect are chamfered 15 prior to the arraying. The pieces 14 and the electrode 11 are then adhered by the solder 13 for adhesion.
申请公布号 JPS62136564(A) 申请公布日期 1987.06.19
申请号 JP19850277543 申请日期 1985.12.10
申请人 TOSHIBA CORP 发明人 SUGIMOTO SHIGEKI;MORI KUNIHIRO;OKUMURA KATSUYA
分类号 H01L21/285;C23C14/34;H01L21/203 主分类号 H01L21/285
代理机构 代理人
主权项
地址