CVD THIN FILM FORMING DEVICE

摘要

PURPOSE:To prevent a wafer from being warped while preventing any foreign matters in furnace or dust from sticking on the surface of wafer by a method wherein a means to preheat the wafer before it is loaded on a wafer mounting base is arranged on a wafer loader. CONSTITUTION:A wafer fed from a loader cartridge 2 is not directly carried on to a wafer mounting base 4 in a reaction furnace 1 but once carried to a preheating part 6 to be preheated up to around 200 deg.C. The wafer 3 fed from the loader cartridge 2 is slowly heated while being carried in the tunnel type preheating part 6 toward the pate part 5 of reaction furnace 1 to be preheated up to specified temperature. The preheated wafer 3 is carried onto the wafer mounting base 4 in the reaction furnace 1 by a wafer holding means. Through these procedures, the temperature difference can be reduced to prevent the wafer 3 from being warped.