| 摘要 |
<p>PURPOSE:To eliminate the need to consider differences in integration in a mounting process, by forming a cooling fin of a shape-memory alloy. CONSTITUTION:A cooling fin 1 for an electronic device is formed of a shape- memory alloy. Alloys of Ni-Cr, Au-Cd, In-Tl, Cu-Zn, Cu-Sn, Ni-Al groups and so on are used as the shape-memory alloy. Then, the surface of the fin 1 changes with heat values which change with operational states of the semiconductor device. Therefore, it becomes unnecessary to consider differences in integration in a mounting process.</p> |
