| 摘要 |
PURPOSE:To plate a noble metal on the surface of a Ti metal by immersing the Ti metallic parts subjected to surface polishing into an electroless Ni-P plating liquid to first deposit Ni-P thereon by electrolytic plating then depositing Ni-P thereon by electroless or electrolytic plating and plating the noble metal thereon. CONSTITUTION:After the surface of the ornamental parts made of Ti or Ti alloy is polished to a specular surface, the parts are degreased and rinsed and further the parts are pickled with an F-contg. liquid by which TiO2 on the surface is removed. Such parts are rinsed. The parts are immersed for about one minute in an aq. Rochelle salt soln. and is pulled up. The parts are immersed into an electroless Ni-P alloy plating liquid quickly after rinsing and electricity is conducted between said parts and a Pt anode to form the electrolytically plated Ni-P film. The Ni-P plating film is formed to about 1mu thickness by the electroless or electrolytic plating in the same plating liquid and is heat- treated at 200-400 deg.C to improve the adhesiveness. The noble metal for ornamentation such as Au, Pt, or Rh is finally electroplated.
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