LSI CHIP MOUNTING CARD

摘要

PURPOSE:To realize mounting of a plurality of chips in the same area by providing a hole to the card. CONSTITUTION:A hole 4 is provided at the internal side of a metal bump 1 provided between a chip 3 and a card 2 just below the chip on the card 2 where the chip 3 is mounted with the face directed downward. A chip 5 smaller than the chip 3 by the area of bump 1 is mounted by the flip chip bonding method. With this structure, two sheets of chip can be mounted on the same area. Total of four chips can be mounted by attaching two sheets of such card.