| 摘要 |
PURPOSE:To form a uniform plating film on a plate to be plated by parallel disposing a flat plate-shaped object to be plated and plating electrode in the form of a resembling shape, covering the entire outside wall part thereof with an insulating case and executing plating while forcibly circulating a plating liquid. CONSTITUTION:The electrode 2 having the shape resembling to the shape of the flat plate-shaped object 1 to be plated is disposed to face said object in such a manner that both the object and electrode are parallel with each other and that the central axes are aligned. The entire outside wall part of the object 1 and the electrode 2 are covered with the insulating case 3 formed to the resembling shape. The plating liquid in the case 3 is circulated like arrows by a pump 9 in a pipe 8 welded at slit holes 6, 7. The gas generated by the plating reaction is discharged from a gas vent hole 5. The electric lines of force between the object 1 and the electrode 2 are distributed approximately uniformly over the entire surface of the object 1 around the central axis, by which the plating film having a uniform thickness is formed on the object 1; in addition, the uniform plating film having no pits is formed by the circulation of the plating liquid and the removal of the generated gas.
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