| 摘要 |
PURPOSE:To remove plating to an unnecessary section, and to eliminate the need for inserting a spacer by coating sections except a region, to which a chip is brazed, with an insulating layer and electroplating the sections except the region and using said insulating layer for insulating a lead. CONSTITUTION:Resists 2 through a photo-process is formed to sections except a region, to which an IC chip 5 is brazed, on a heat sink 1 consisting of copper, etc., and a plating layer 3 composed of Ni, etc. is shaped, employing the resist 2 as a mask. The chip 5 is brazed onto the layer 3 by solder 4. Leads 6 are fixed onto the resist 2, and conductors 7 are bonded with the leads 6 and the chip 5. According to the method, the leads 6 can be fitted onto the heat sink 1 without performing plating to unnecessary sections and interposing spacers.
|
