| 摘要 |
PURPOSE:To prevent resin from bleeding to the surface of a heat sink plate by dividing it into an inner cavity block and an outer cavity block, and contacting under pressure the end of the outer block in a ring shape with the surface of the plate. CONSTITUTION:When a heat sink plate exposure type semiconductor device is set in a sealing device and tightened by upper and first lower molds 1, 2a, external leads 6 are held strongly. Resin filled in the molds 1, 2a as well as an outer cavity space 7 surrounded by a heat sink plate 5 is stopped by the end of an inner cavity forming lower mold 2b and not bled from this range. That is, since the end of the mold 2b is effectively contacted with the plate 5 and the pressure is simultaneously applied to each other, the resin 7 is not bled toward the lower space 11 of the plate.
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