| 摘要 |
PURPOSE:To obtain the titled adhesive sheet suitable for the simultaneous mechanical bonding and electrical connection of an electronic part and a circuit board, by uniformly dispersing electrically conductive particles in an insulating adhesive having a softening temperature of higher than a specific level and extrusion-molding the dispersion. CONSTITUTION:The objective electrically conductive sheet can be produced by uniformly dispersing (A) electrically conductive particles (e.g. solder, Ni, Cu, etc., having a particle diameter of preferably 0.1-100mum) in (B) an insulating resin having a softening point of >=150 deg.C (e.g. polyacrylate resin, etc.). The amount of the component A is preferably 0.5-100pts.(wt.) per 100pts. of the component B.
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