发明名称 INTEGRATED CIRCUIT SUBSTRATES & MASKS
摘要 A mask (1) is made by exposing a pattern (2) of several different dice A to I through reducing lens (3). The mask is exposed several times to produce composite representations CR1 to CR9 on the mask. Several different composite representations may be formed on the same mask using different patterns (cf Fig. 7). The mask 1 is contact printed onto a resist on an to integrated circuit substrate. The area of the mask (74) covered by the composite representations CR10 to CR79 may be greater than the area of the substrate (75) such that for composite representations CR74, CR76, CR77 and CR79 only a portion is reproduced on the substrate but some of those dice not reproduced in one of the composite representations will be reproduced in another of the composite representations. One half of the mask may have composite representations relating to one processing step, whilst the other half of the mask relates to a different processing step, the mask being reoriented after the first step so that the part of the substrate exposed initially to the one half of the mask is subsequently exposed to the other half of the mask, the other part of the substrate being rejected. <IMAGE>
申请公布号 GB8709208(D0) 申请公布日期 1987.05.20
申请号 GB19870009208 申请日期 1987.04.16
申请人 SMITHS INDUSTRIES PLC 发明人
分类号 G03F1/00;G03F7/20 主分类号 G03F1/00
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