| 摘要 |
PURPOSE:To improve the airtight-sealing property while reducing the distortion due to thermal shock produced by a semiconductor element by a method wherein a flexible resin is used together with an epoxy resin as well as a potential hardener and filler at specified weight percentage. CONSTITUTION:A cover member 5 to airtight-seal a semiconductor element 1 through the intermediary of a bonding agent 6 is blended with epoxy resin containing 1-60wt% of flexible resin, 1-10wt% of potential hardener per 100wt% of epoxy resin and 10-180wt% of filler. Any stress due to thermal distortion can be relieved by the flexible resin used together to prevent the characteristics such as humidity resistance, etc. from deteriorating. |
