| 摘要 |
PURPOSE:To prevent an IC from breakdown due to the erroneous insertion of the titled device by a method wherein the number of the high-withstand voltage system signal pads of a chip and the number of the long rectanglelike electrodes of a package for chip carrier IC wherein the chip is encapsulated are set equal and the pads of the both are connected to one another. CONSTITUTION:A package for chip carrier IC is constituted of short rectanglelike electrodes 2 in contact with a circuit substrate or sockets for chip carrier IC, long rectanglelike electrodes 3 of the same number as that of high-withstand voltage system signal pads of a semiconductor integrated circuit to be encapsulated and an insulating package 1 with its cut corners. A chip 5 of the semiconductor integrated circuit is mounted on this package, and the high-withstand voltage system signal pads and pads being connected to the electrodes 3 corresponding to the high-withstand voltage system signal pads are connected with bonding wires. As the sockets for chip carrier IC, if they are sockets having long rectanglelike electrodes in a structure wherein the sockets come into contact only with the parts peculiar to the long rectangle form, it is not necessary for the high-withstand voltage system signal part to be connected to the low-withstand voltage system signal part even when the integrated circuit device to be encapsulated in the package is erroneously inserted and the integrated circuit is prevented from breakdown due to a test. |
