| 摘要 |
PURPOSE:To improve heat-dissipating characteristics while also filling the role as a spacer by fitting a radiation fin functioning as the spacer in combination to the lower surface of a package base. CONSTITUTION:A semiconductor element 4 is loaded on a base 3, the element 4 and wirings for the base 3 are connected by connector wires 5, and the element 4 is connected to a larger number of lead pins 6 droopingly provided in the downward direction to the back of the base 3. A cap 8 is mounted onto the base 3 by a bonding material 7. A radiation fin 9 functioning as a spacer in combination is fitted to the lower surface of the base 3 for the PGA package by a bonding material 10. The radiation fin 9 is constituted of an extrusion molded shape, etc., such as a copper casting used for cooling a semiconductor device, aluminum, etc. The bonding material 10 is composed of a material such as an silicone group rubber adhesive, and the base 3 is organized by a plate such as a glass epoxy wiring substrate. |
