| 摘要 |
PURPOSE:To remove a bridge solder with suction by capillary phenomenon and to realize good soldering simply by dipping a soldering part in a molten solder together with the brush which is composed of numerous fine metallic wires and by separating it from the brush after the ascent. CONSTITUTION:The lead L of the connector C which is fitted to a print board P is pushed down against the spring 5 energizing to the upper part together with the brush 2 which is composed of numerous fine metallic wires and dipped into the upwash molten metal of a solder tank 1. The lead L is ascended with the brush 2, thereafter the lead part L is separated from the brush 2. The bridge generation is completely prevented with very simple method because of the solder formed by the bridge being sucked to the fine wire side with capillary phenomenon due to the fine wire gap of the brush 2 being narrower than the gap of the lead L. |
