| 摘要 |
Polyamide adhesives for bonding fabrics which allow for a lower bonding temperature than had been possible with similar previously available polyamide fabric bonding resins. The polyamide adhesives of the present invention are particularly suitable for use as fusible interliners for fabrics which demonstrate excellent retention of adhesive properties even after repeated cleaning by laundering and/or dry cleaning. The polyamide adhesive is an amidification product of (a) caprolactam, (b) a diamine component which is 50-75 eq. % hexamethylene diamine, and 25-50 eq. % piperazine, or 2-methyl pentamethylene diamine, and (c) a mixture of a polymeric fat acid and an aliphatic straight chain co-dicarboxylic acid having 6-12 carbon atoms.
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