| 摘要 |
PURPOSE:To obtain the titled lead material having high strength, superior heat resistance and superior reliability with respect to soldering by using a Cu alloy having a specified composition consisting of Fe, P, An, Mg and Cu. CONSTITUTION:A Cu alloy lead material for a semiconductor device having high strength, superior heat resistance and superior reliability with respect to soldering is obtd. by using a Cu alloy having a composition consisting of, by weight, 2-2.4% Fe, 0.001-0.1% P, 0.01-1% Zn, 0.001-0.1% Mg and the balance Cu with inevitable impurities. The lead material also has superior elongation, electric conductivity, suitability to stamping (blanking), etching and plating and superior adhesion to solder and shows superior performance as a lead material for a semiconductor device having a high degree of integration. |
