| 摘要 |
PURPOSE:To improve the yield and the reliability by contacting the electrodes of a semiconductor pellet under pressure with the top face of a projection, and fusion-bonding the both ends of a glass sleeve at the peripheral protrusion of the projection to prevent a crack or a breakage during manufacturing steps. CONSTITUTION:A projecting metal terminal 14 is inserted into a carbon sealing jig, and a glass sleeve 12 is then associated. Then, a semiconductor pellet 11 is placed on the top of the center of the terminal 14 with the inner wall of the sleeve 12 as a guide. Then, a projecting metal terminal 13 is placed on one electrode of the pellet 11. When the completely associated jig is bonded to the terminals 13, 14 when the sleeve 12 is melted in a melting furnace, and the pellet 11 is completely hermetically sealed in the sleeve 12. Since the both ends of the sleeve are protected by the metal terminals, no crack nor breakage is generated during the manufacturing steps. |
