| 摘要 |
<p>A process of drawing and cutting, at low temperature, for preparing discontinuous filament bundles, which comprises applying a drawing force and/or a shearing force to a continuous filament bundle subjected to cooling to a temperature below -5 degree C, for drawing and cutting the respective single filaments which constitute the continuous filament bundle, removing the water contained in the continuous filament bundle in the environmental gaseous medium before cooling or during cooling and, optionally, removing the frost formed during cooling (Fig. 23).</p> |
