| 摘要 |
PURPOSE:To prevent for a metal fine wire to exfoliate from a semiconductor substrate on a conductor, by reinforcing a connection part with adhesive agent after connecting the metal fine wire with the semiconductor substrate or conductor. CONSTITUTION:After the stitch bonding of a gold wire 3 to a lead part 26, conductive resin 5, epoxyresin containing Ag for example, is spread on a connection part between the lead part 2b and the gold wire 3. Then even if the gold wire 3 tends to exfoliate at the time of a stitch bonding because of its elasticity, connection defect does not occur, because the connection part 4 is reinforced with a resin 5. |
