| 摘要 |
PURPOSE:To obtain a titled parte which provides a thick film integrated circuit having high reliability at a low calcination temp. without having a change in the characteristics by kneading powder obtd. by grinding a specific sintered body with a binder and solvent. CONSTITUTION:The sintered body obtd. by mixing glass powder and ceramic powder, then heating the mixture to the melting temp. of glass or above is ground to obtain the glass ceramic powder preliminarily coated with the glass on the surface of the ceramics. Such powder is mixed with a binder such as polyvinyl butyral and a solvent such as terpineol or aceton is added to the mixture and after the mixture is kneaded with a ball mill, etc., the acetone is evaporated by an automated mortar. The titled paste for low-temp. calcination which can be successfully calcined even at about 100 deg.C lower calcination temp. |
