| 摘要 |
<p>An automatic soldering method and apparatus, which are capable of carrying out with a high accuracy and a high efficiency a point soldering operation using a wire solder (14) with respect to a work surface. The soldering method consists of the steps of lowering a soldering trowel (12) toward a work surface (4, 72) by an air cylinder (9), carrying out a primary solder feeding operation by extending a wire solder (14) to a position a little lower than the soldering trowel simultaneously with the air cylinder lowering operation, melting this wire solder with a free end portion of the soldering trowel (12), wetting the free end portion of the soldering trowel (12), bringing the soldering trowel (12) into contact with the work surface (4, 72) to wet the same as well while heating the same, and carrying out a secondary solder feeding operation by extending the wire solder (14) again toward the free end of the soldering trowel (12).</p> |
