发明名称 |
Electroless copper plating bath and method |
摘要 |
An electroless copper plating bath is prepared by adding both a metal-cyano-complex used as a stabilizer and an agent for complexing the metal of the metal-cyano-complex to an electroless copper plating bath containing cupric ion, an agent for complexing the cupric ion and a reducing agent, and an article to be plated is immersed in the bath.
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申请公布号 |
US4650691(A) |
申请公布日期 |
1987.03.17 |
申请号 |
US19840653848 |
申请日期 |
1984.09.24 |
申请人 |
C. UYEMURA & CO., LTD. |
发明人 |
KINOSHITA, AKEMI;ARAKI, KEN;NAWAFUNE, HIDEMI;MIZUMOTO, SHOZO |
分类号 |
C23C18/40;(IPC1-7):C23C18/40 |
主分类号 |
C23C18/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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