发明名称 PLATE THICKNESS AUTOMATIC CONTROL DEVICE
摘要 <p>PURPOSE:To improve the plate thickness accuracy by changing over automatically from the plate thickness control by a rolling reduction amt. to that by a tension on detection of a roll kissing state. CONSTITUTION:The data of the plate thickness detector 4 at the rear part of a rolling mill 1 and data of a rolling load meter 6 are inputted to the roll kiss discriminating circuit 18 including a rolling reduction position arithmetic circuit and discriminating circuit and the roll kiss state is discriminated therein. The respective plate thickness control command value of an estimated plate thickness control circuit 10, gage meter type plate thickness control circuit 11 and monitor plate thickness control circuit 12 is added by an adder 13 and respectively operated in a rolling reduction converting circuit 14 and tension converting circuit 15. The control signal transmitted from the roll kiss discriminating circuit 18 is led to changing over circuits 16, 17 to carry out a plate thickness control by inputting a plate thickness control command as the rolling reduction amt. to the rolling reduction position control circuit 18 at a ordinary rolling time. And in the roll kiss state a tension plate thickness control is performed as a tension plate thickness control command by a speed control circuit 9. A very thin plate can thus be produced with high accuracy.</p>
申请公布号 JPS63171214(A) 申请公布日期 1988.07.15
申请号 JP19870001638 申请日期 1987.01.09
申请人 HITACHI LTD 发明人 KITANI SUSUMU;SEKIGUCHI KATSUMI
分类号 B21B37/20;B21B37/16;B21B37/18;B21B37/58 主分类号 B21B37/20
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