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经营范围
发明名称
RESIN SEAL PACKAGE STRUCTURE FOR SEMICONDUCTOR CHIP
摘要
申请公布号
JPS6242547(A)
申请公布日期
1987.02.24
申请号
JP19850181098
申请日期
1985.08.20
申请人
OKI ELECTRIC IND CO LTD
发明人
YAMABA TAKAHISA;TABATA SHIGERU
分类号
H01L23/28
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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