| 摘要 |
PURPOSE:To provide a mounting method adapted for the calculating speed of a high speed computer by laminating pair LSI chips in which logic circuits are integrated, bump-connecting by soldering flip-chip electrodes of the respective chips, and mounting them on a circuit board. CONSTITUTION:LSI2 7 pair chips of high speed calculators die bonded to a circuit board 10 side are connected with board side circuit 20 by a thermal press-bonding method via leads 14 like a tape carrier. The electrodes 12 of the LSI1 7 and the electrodes 11 of the laminated pair chips LSI1 6 can be, when bump-connected at 13 after positioned between the electrodes, connected in the shortest distance between the LSI1 and the LSI2. Thus, the pair chips of the high speed calculators LSIs are laminated elevationally by the mounting method to reduce a signal transmission delay due to wirings, thereby performing a high speed computer. |
